Consumer Electronics & Appliances
Thermal bottlenecks from thinner enclosures, drop reliability and acoustic quality are the three most common engineering problems in 3C and appliance products.
What the solution covers
Thermal bottlenecks from thinner enclosures, drop reliability and acoustic quality are the three most common engineering problems in 3C and appliance products.
- System-level electronics cooling and temperature rise
- Drop, crush and structural reliability simulation
- Acoustic cavity and speaker sound quality optimisation
- Class-A surfacing integrated with structural design
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